| Your PCB parameter |
High difficulty threshold |
| Layer count |
> 10 layers, especially > 18 layers |
| Aspect ratio |
> 10:1 |
| Line width/space |
< 0.1mm (4mil), e.g. 3mil/3mil |
| Special processes |
HDI (blind/buried via), backdrill, thick copper (≥3oz), resin plugging |
| Materials |
High‑frequency (Rogers), polyimide, high Tg (>170°C) |
| Impedance |
Differential impedance |
♪ Our senior engineers analyze your Gerber — DFM solutions for complex designs
Focus on high‑difficulty / high‑reliability PCB · prototype first, then volume
New customer: buy one SMIERY → free prototype · prototyping fee deducted from volume order
| Your product type |
Your requirements |
Our capabilities |
| ♪ 5G communication module |
High‑frequency material + HDI + backdrill |
♪ Rogers/PTFE hybrid · ♪ 3‑order HDI · ♪ backdrill stub <6mil |
| ♪ Medical electronics |
High reliability + high Tg + blind/buried via |
♪ Tg170+ · ♪ 0.2mm mechanical drill · ♪ 3‑order HDI |
| ♪ Industrial robot drive |
Multilayer + impedance control + gold fingers |
♪ 8‑16 layers · ♪ impedance ±8% · ♪ gold finger chamfer |
| ♪ Consumer electronics (phone/watch) |
HDI + fine line + laser blind via |
♪ 3‑order HDI · ♪ 2.5mil line width · ♪ 50μm blind via |
| ♪ New energy vehicle control |
Thick copper + high Tg + thermal management |
♪ 3‑30oz thick copper · ♪ Tg170+ · ♪ resin plugging |
♪ upload Gerber · get DFM ♪ request engineer consult
first SMIERY = free prototype → deducted later
high‑difficulty PCB · one SMIERY
