|
| Fabriaction flow |
PCB layers |
1-2 L |
| Lamination Cutting |
PCB thickness |
0.4 mm , 0.6 mm , 0.8mm , 1.2 mm , 1.6 mm , 2.0 mm |
| Drill |
Holes type |
Trough holes |
| Smallest hole size |
12 mil |
| Hole distance |
36 mil |
| Hole Plating |
Thickness of hole wall |
20 um |
| Circuit |
Copper weight |
Outer copper 1 oz |
| Copper trace in width |
6 mil |
| Copper space |
6 mil |
| Hole ring |
6 mil |
| Solder mask |
Solder mask openning |
6 mil |
| Via holes |
Tented with solder mask |
| Surface treatment |
Surface treatment |
Lead-free hasl , OSP |
| Silkscreen text |
Silkscreen text bold |
6 mil |
| Route shape |
Inner cutout : |
24 mil |
| V-cut : |
Across |
| V-cut degree : |
Any |
| PCB shape |
Regular and irregular |
| PCB Size |
60 cm * 60 cm MAX |
| Qty |
Tolerance : |
|
| Pth Hole size |
+/- 2 mil |
| Board thickness |
T≥1.6mm +/- 10% ； T＜1.6mm +/- 0.1 |
| The PCBs are fabricated according to IPC 6012 class II |
| Fabriaction flow |
PCB layers |
4L |
| Lamination Cutting |
PCB thickness |
0.4 mm , 0.6 mm , 0.8mm , 1.2 mm , 1.6 mm , 2.0 mm |
| Inner layers |
Inner layer |
copper weight H oz , 1 oz |
| Layer stackup |
PP type 7628 , 1080, 2116 , by random |
| Drill |
Holes type |
Trough holes |
| Thickness of hole wall |
25 um |
| Smallest hole size |
12 mil |
| Hole distance |
36 mil |
| Hole Plating |
Copper weight |
Outer copper 1 oz |
| Circuit |
Copper trace in width |
6 mil |
| Copper space |
6 mil |
| Hole ring |
6 mil |
| Solder mask |
Solder mask openning |
6 mil |
| Via holes |
Tented with solder mask |
| Surface treatment |
Surface treatment |
Lead-free hasl , OSP |
| Silkscreen text |
Silkscreen text bold |
6 mil |
| Route shape |
Inner cutout : |
24 mil |
| V-cut : |
Across |
| V-cut degree : |
Any |
| PCB shape |
Regular and irregular |
| PCB Size |
60 cm * 60 cm MAX |
| Qty |
Tolerance : |
|
| Pth Hole size |
+/- 2 mil |
| Board thickness |
T≥1.6mm +/- 10% ； T＜1.6mm +/- 0.1 |
| The PCBs are fabricated according to IPC 6012 class II |
|
|
