| Core material |
Glass fibre + epoxy |
Aluminium plate + insulation + copper foil |
Polyimide (PI) film + copper foil |
| Key parameter |
Tg: 130‑180°C |
Thermal conductivity: 0.6‑5.0 W/m·K |
Bending cycles: >11,000 |
| Typical thickness |
1.6mm (standard) |
1.0‑1.5mm |
0.1‑0.2mm (base) |
| Thickness range |
0.075‑3.2mm |
0.4‑5.0mm |
0.05‑0.5mm (no stiffener) |
| Max. length |
≤2m (equipment limit) |
≤2m |
Theoretically unlimited (roll‑to‑roll) |
| Multilayer capability |
2‑16 layers |
1‑2 layers |
1‑4 layers |
| Plated through holes |
✔ supported |
✘ not supported |
✔ supported |
| Flexibility |
✘ rigid |
✘ rigid |
✔ bendable / rollable |
| Thermal conductivity |
poor (0.3 W/m·K) |
excellent (1.0‑5.0 W/m·K) |
poor (0.2‑0.3 W/m·K) |
| Applicable power |
low power (≤0.5W LED) |
medium‑high power (>1W LED) |
low power (≤0.2W LED) |
| Surface finish |
HASL / ENIG / OSP |
HASL / ENIG |
mainly ENIG (flex‑friendly) |
| Production process |
sheet‑by‑sheet, standard PCB |
sheet‑by‑sheet + insulation |
roll‑to‑roll continuous |
| Cost level |
low |
medium |
high |
| Typical applications |
LED displays, hard strips, indicators |
ceiling lights, street lamps, automotive, spotlights |
flexible strips, decorative shapes, wearables |
| Selection criteria |
circuit complexity, cost sensitivity |
power / heat dissipation |
bending requirement, space limitation |
