BGA is not one package — it is an entire family.
Different BGAs have completely different challenges. Using the same process for all BGAs will definitely cause problems.
Our capability covers all BGA types with dedicated processes.
| Package Type | We Can Do | Difficulty | Key Process |
|---|---|---|---|
| PBGA | ♫ ♪ | Low | Incoming baking — prevent popcorn effect |
| FBGA (fine pitch 0.5-0.8mm) | ♩ ♪ | Medium-High | Thin stencil + laser cutting + 3D AOI |
| UBGA (ultra-fine pitch ≤0.4mm) | ♫ ♩ | High | 0.08mm stencil + 3D X-ray + specialized solder paste |
| CBGA | ♪ ♫ | Medium-High | Optimized reflow profile — prevent thermal stress cracking |
| PoP (Package-on-Package) | ♩ ♬ | High | Specialized process — independent top/bottom temperature monitoring |
| WBGA (wafer-level) | ♪ ♫ | High | Ultra-low placement pressure — special nozzle |
| Large BGAs (>35×35mm) | ♬ ♪ | Medium-High | Reflow fixture to flatten board — corner pad solder supplement |
